Problem Statement

Which of these conditions tend to promote electromigration? Distance between trace Moisture and BIAS Flux residues Voltage creepage Which of these surfaces would you classify as solderable? Titanium Brass Tin Bare Copper Which of these terms has nothing to do with soldering? Sputtering Fountain Solder Reflow Sintering If you need to mount a glass die onto a circuit board, which method should you pick? adhesive mount anisotropic conductive film Sintering Soldering Is it possible to mount more than one component onto the same pads on a circuit board? No, pads corespond to a single component Squeeze the parts to fit No, multiple parts cannot fit Stackup the parts on the same pad What keeps SMT components from dropping off during a second reflow pass? Reflow temperature Solder paste surface tension Solder paste surace insulation Board Carrier Which method would you use to check cleanliness and count NaCl contaminants on a printed circuit assembly? Scanning Acoustic Microscopy Differential