TSMC

Role: Process Engineering (Lithography)

College: Recent graduate (May 2025) from a non-semiconductor-focused university.

Interview Date: July 2025

Interview Type: Full-Time (virtual)

Result: Rejected (no offer or follow-up)

Difficulty: Medium

Rounds: At least 1 virtual interview

Topics Asked: Technical questions related to lithography, general behavioral questions, company culture, relevance of personal background (e.g., living in Asia) to potential training in Taiwan.

Experience:

This candidate, a May 2025 chemical engineering graduate, received an invitation for a virtual interview for a Process Engineering position in Fab 21 at Phoenix, specifically for lithography. The candidate had relevant graduate-level electives in polymer science and catalysis, and extensive lab experience, though not in a cleanroom. They prepared by researching TSMC's operations, including the potential for new hires to train in Taiwan. The interview involved technical questions on lithography and behavioral questions, where the candidate aimed to highlight their diverse background and experience with different cultures. The candidate did not receive an offer or follow-up after the interview.